For iPhone 17 Pro Max 10 PCS/Pack Mainboard Heat Sink Sticker + FPC Sponge Foam Pads
from
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-6%
Rs.1,644.00
Rs.1,744.00
- Stock: In Stock
- Model: HUM-MOB-SP-289
- Weight: 0.10kg
- Dimensions: 19.00cm x 12.00cm x 5.00cm
- SKU: HUM-MOB-SP-289
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1. Motherboard heat sink sticker + FPC connector sponge foam pads replacement part
2. Replace your broken or unworkable part with a new one
3. Each item has been checked and in good condition before shipping
4. Completely fit and work
5. Professional installation is highly recommended. We will not be responsible for any damages to your device that you may cause during the changing of replacement parts.
| Product Details | |
| Origin Country | China |